According to PANews on November 18, the first modular AI data preprocessing layer DIN has officially launched Chipper node pre-mining, and the activity will last until December 4.

DIN node pre-mining is mainly used to produce xDIN, which is the main basis for DIN token airdrops. During the pre-mining period, Wafer point holders can convert Wafer into xDIN, and node holders can earn xDIN and BNB by running nodes. Users with more computing power resources can apply to become node entrustors and earn more xDIN by running entrusting nodes. Currently, xDIN is an on-chain point token and does not support transfers, but can be traded on the over-the-counter trading platform Tadle. Please note that trading may result in the loss of airdrop qualifications, and users can choose whether to trade.

During the DIN TGE, all users will receive DIN airdrops based on their xDIN holdings. It is worth noting that this part of the DIN airdrop will be 100% released, without complex mechanisms such as lock-up or linear unlocking.