PANews 4月12日消息，据联合报报道，据调查，一度因开发时程延误的台积电3nm制程近期获得重大突破，延误曾导致苹果新一代处理器仍采用5nm加强版N4P。台积电决定今年率先量产第二版3nm制程N3B，将于今年8月于新竹12厂研发中心第八期工厂及南科18厂、P5厂同步投片，正式以鳍式场效晶体管（FinFET）架构，对决三星的环绕闸极（GAA）制程。
台积电3nm制程N3B将于今年8月投片
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Author: PA一线
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