PANews 12月12日消息，据吴说区块链从接近台积电人士处获悉，比特大陆5nm矿机芯片，或为全球第一颗已完成封装的5nm测试级芯片。据悉，台积电5nm测试芯片的良品率平均已达80％，将在2020年上半年投入大规模量产，和7nm相比性能提升在7%到15%之间。此前嘉楠曾拔得全球第一颗7nm测试级芯片头筹。另据其此前报道，5nm芯片的矿机或在明年一季度之后、第二季度发布。
比特大陆5nm芯片或成全球首颗已完成封装的5nm测试级芯片
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比特大陆5nm矿机芯片，或为全球第一颗已完成封装的5nm测试级芯片。
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